不同散热器结构对其散热特性影响的数值研究
Numerical Investigation of the Effect of Different Radiator Structures on Heat Dissipation Characteristics
张春成 1袁瑞明 2吕强 2章钢 2侍书成2
作者信息
- 1. 海军装备部驻西安地区军事代表局,西安 710000
- 2. 中国电子科技集团第五十二研究所,杭州 311100
- 折叠
摘要
本文采用Flotherm热仿真软件,分别研究了翅片布局、散热器参数变化以及布置风机对散热器散热特性的影响.研究表明:①芯片节点温度Tj随空气流速Uc的提高而逐渐降低.相比于翅片沿散热器长度方向布置,翅片沿散热器宽度方向布置更优,散热器散热性能更好,芯片节点温度更低,但是随着空气流速逐渐升高时,这种优势逐渐降低.②当基板和翅片总高度一定时,存在一组最优的基板高度和翅片高度,使得散热器的散热性能最优,芯片节点温度最小.③当空气流速较低时,相比于散热器(不带风机),散热器(带风机)可明显降低芯片节点温度,节点温度降幅Tj%随空气流速Uc的提高而减小.当空气流速增大一定程度时,节点温度降幅Tj%为负值,即散热器(带风机)散热性能更差,芯片节点温度反而更高.
Abstract
In this paper,the influences of fin layout,radiator parameters,and fan arrangement on the heat dissipation characteristics of the radiator are investigated by Flotherm thermal simulation software.It discovers that:①The chip node temperature Tj gradually decreases with the increase of air flow velocity Uc.Compared with the fins arranged along the length of the radiator,the arrangement of the fins along the width of the radiator is more optimal,the radiator has better cooling performance,and the chip node temperature is lower.However,as the air flow velocity increases gradually,this advantage gradually decreases.②When the total height of the substrate and fin is fixed,there exists a set of optimal substrate height and fin height,which makes the heat dissipation performance of the radiator optimal and the chip node temperature minimum.③When the air flow velocity is low,compared with the radiator(without fan),the radiator(with fan)can significantly reduce the chip node temperature.The node temperature drop Tj%decreases with the increase of air Uc.When the air flow velocity increases to a certain extent,the node temperature drop Tj%is negative,the cooling performance of the radiator(with fan)is worse,and the chip node temperature is higher.
关键词
散热器/风机/散热特性/温降Key words
radiator/fan/heat dissipation characteristic/temperature drop引用本文复制引用
出版年
2024
NETL
NSTL
万方数据