首页|低噪声放大器热真空试验可靠性与失效机理研究

低噪声放大器热真空试验可靠性与失效机理研究

扫码查看
应用于航天领域的低噪声放大器,作为无线通信设备的前段核心部件,其工作环境复杂,无法进行及时的更换和维修.为了保障无线通信设备要求高可靠、长寿命,本文选择四通道接收组件一只进行热真空试验.该组件的低噪声放大器在温度范围为(-55~150)℃的热真空试验下,均发生不同程度的退化和失效,并借助金相显微镜、扫描电镜(SEM)、聚焦离子束(FIB)及微光显微镜(EMMI)等失效分析设备对试验后组件中的低噪声放大器芯片开展失效分析研究,确定芯片的薄弱环节和失效机理,为优化低噪声放大器设计,提高其在太空环境下的性能和可靠性提供实验依据.
Study on Reliability and Failure Mechanism of Thermal Vacuum Test for Low Noise Amplifier
The low noise amplifier used in the aerospace field,as the core component of the front section of the wireless communication equipment,has a complex working environment and cannot be replaced and repaired in time.In order to ensure the high reliability and long life of wireless communication equipment,this paper selects one of the four-channel receiving components for thermal vacuum test.The low noise amplifier of the module was degraded and failed in varying degrees under the thermal vacuum test with the temperature range of(-55~150)℃.The failure analysis of the low noise amplifier chip in the module after the test was carried out by means of failure analysis equipment such as metallographic microscope,scanning electron microscope(SEM),focused ion beam(FIB)and low light microscope(EMMI).The weak links and failure mechanism of the chip were determined,which provided experimental basis for optimizing the design of low noise amplifier and improving its performance and reliability in space environment.

low noise amplifierthermal vacuum testreliabilityfailure analysis

刘国强

展开 >

中国电子科技集团公司第十三研究所,石家庄 050051

低噪声放大器 热真空试验 可靠性 失效分析

2024

环境技术
广州电器科学研究院有限公司

环境技术

CSTPCD
影响因子:0.995
ISSN:1004-7204
年,卷(期):2024.42(7)