Study on Reliability and Failure Mechanism of Thermal Vacuum Test for Low Noise Amplifier
The low noise amplifier used in the aerospace field,as the core component of the front section of the wireless communication equipment,has a complex working environment and cannot be replaced and repaired in time.In order to ensure the high reliability and long life of wireless communication equipment,this paper selects one of the four-channel receiving components for thermal vacuum test.The low noise amplifier of the module was degraded and failed in varying degrees under the thermal vacuum test with the temperature range of(-55~150)℃.The failure analysis of the low noise amplifier chip in the module after the test was carried out by means of failure analysis equipment such as metallographic microscope,scanning electron microscope(SEM),focused ion beam(FIB)and low light microscope(EMMI).The weak links and failure mechanism of the chip were determined,which provided experimental basis for optimizing the design of low noise amplifier and improving its performance and reliability in space environment.