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特种器件低成本替代可行性研究

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随着特种器件国产化覆盖率的不断提高,目前面临的一大难题是元器件成本居高不下.为了解决这一问题,民用领域主流的商业级、工业级、车规级器件成为了低成本替代的关注对象.本文结合研究特种级器件与商业级、工业级、车规级芯片质量管控体系及可靠性测试覆盖率的差异,探究民用塑封作为特种替代的可行性.
Feasibility Study on Low-Cost Substitution of Special Devices
With the continuous improvement of the localization coverage of special devices,a major problem facing is the high cost of devices.In order to solve this problem,the mainstream commercial-grade,industrial-grade,and vehicle-grade chips in the civilian field have become the focus of low-cost alternatives.This article combines the research on the differences in quality control systems and reliability testing coverage between special grade chips and commercial,industrial,and automotive grade chips,and explores the feasibility of using civilian plastic packaging as a special substitute.

special gradecommercial gradeindustrial gradeautomotive gradelow costalternative

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中国电子科技集团公司第五十八研究所,无锡 214000

特种级 商业级 工业级 车规级 低成本 替代

2024

环境技术
广州电器科学研究院有限公司

环境技术

CSTPCD
影响因子:0.995
ISSN:1004-7204
年,卷(期):2024.42(8)