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汽车电子电器产品锡须测评方法研究

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本文针对电子电器产品的锡须可能导致汽车产品在使用寿命中出现故障,介绍了锡须的危害、锡须生长机理、诱发因素及预防措施.重点研究了锡须生长试验,即通过温湿度循环试验、高温放置试验、温度循环试验等环境试验组合能够有效加速锡须生长.最后叙述了通过光学显微镜、电子显微镜等设备进行锡须测量,研究如何科学有效地评估锡须,为无铅电子器件在汽车行业的高可靠使用提供试验指导.
Research on Test Method for Measuring Tin Whisker on Electric and Electronic Products in Vehicles
The tin whisker of electric and electronic products may lead to failure in the service of vehicles.In this paper,analyzes the harm of tin whiskers,introduces the growth mechanism,inducing factors and preventative actions.Focuses on the accelerated tin whisker growth tests,such as temperature/humidity cycling test,high temperature storage test,temperature shock test.It describes measuring of whisker length by optical microscope or SEM/EDX,acceptance criteria of tin whisker,provide test guidance for the high reliability of lead-free devices in the automotive industry.

tin whiskertest conditions of whisker growthwhisker inspectionacceptance criteria for whisker

范学、王胜、倪倩雅、王留喜

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比亚迪汽车工业有限公司,深圳 518118

锡须 锡须生长试验 锡须测量 锡须评估

2024

环境技术
广州电器科学研究院有限公司

环境技术

CSTPCD
影响因子:0.995
ISSN:1004-7204
年,卷(期):2024.42(11)