Analysis of Plastic Encapsulated Microcircuits Leakage Current after Pressure Cooking Test
Plastic encapsulated microelectronics(PEMs)are susceptible to moisture intrusion,leading to phenomena such as delamination of the encapsulating material and corrosion of the metal layer,resulting in the degradation of circuit performance and even failure.To ensure their reliability,temperature and humidity accelerated stress tests-Pressure Cooker Test(PCT),are commonly conducted as part of the evaluation process for PEMs.In this study,a plastic device exhibited leakage failure during electrical performance testing after undergoing PCT.Variousequipments were employed to analysis the morphology and element,such as SEM,EDS,XRD and other equipment,to explore the causation of corrosion,and the leakage failure mechanism of the PEMs after PCT was determined.Finally,the failure mechanism was verified by comparing quadruple sample,and the verification results were consistent with failure phenomena.The results indicate that in a high-temperature,high-humidity environment,impurity ions present on the surface of the PEMs form an electrolyte with water.This leads to a corrosion reaction of the tin plating on the pins,with the corroded ions migrating and crystallizing on the surface of the packaging,forming a film of tin oxide.This film creates a leakage path,causing leakage failure after PCT.
plastic encapsulated microelectronicsPCTplatingcorrosionleakage current
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