Research and Demonstration of Copper Deposition Method for Microporous Test of Electroplated Parts
This article aims to conduct in-depth research and rigorous argumentation on the copper deposition method for testing the micro-pores of electroplated components,in order to reveal its effectiveness in detecting and evaluating the quality of micro-pores in electroplated components.To achieve this goal,we have adopted a comprehensive research method and have detailed the experimental process,demonstrating the impact of different conditions on the results.During the experiment,we adjusted various parameters such as current intensity and testing time to investigate their influence on copper deposition.Through these careful studies,we found that the copper deposition method for testing micro-pores of electroplated components has high accuracy,enabling accurate detection of the number of micro-pores and the surface quality of electroplated product.In addition,the method's results have high reproducibility and reliability.The main conclusion of this study is that the copper deposition method can effectively evaluate the quality of micro-pores on the surface of electroplated components during micro-pore testing.This discovery is of great significance for improving the detection of micro-pores in electroplated components.
micro-Pore testing on electroplated partscopper deposition methodmicro-pore quantity
万方数据
维普
