Atomic diffusion behavior in the interface formation of copper-aluminum electromagnetic pulse welding
Electromagnetic Pulse Welding(EMPW)techno-logy is widely concerned because of the reliable connection of dissimilar metals driven by high-voltage discharge.However,the interface bonding mechanism is still unclear.A compre-hensive experimental platform for copper-aluminum EMPW is set up,the welding dynamic process is captured,and the colli-sion velocity and angle are obtained.Based on these paramet-ers,a molecular dynamics simulation model is constructed for the formation of typical interfaces(flat interface and vortex in-terface)in EMPW.The atomic diffusion behavior in the weld-ing process is studied,and the thickness of the diffusion layer at the typical interface is calculated.The microstructure of the bonding interface is analyzed by the transmission electron mi-croscopy.The research results show that the severe collision drives the plastic deformation of the interface material,which forms metallurgical bonding and mechanical engagement.This is the bonding mechanism of the copper aluminum EMPW in-terface.And the atomic diffusion thickness at the vortex inter-face is greater than that at the flat interface.This paper can provide a scientific basis for further understanding the mechan-ism of EMPW and regulating the welding effect.
NETL
NSTL
万方数据
