首页|Cu/V复合中间层对TC4/IN718激光焊接接头组织及性能的影响

Cu/V复合中间层对TC4/IN718激光焊接接头组织及性能的影响

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为了实现TC4钛合金与GH4169镍基高温合金的有效连接.采用Cu/V复合中间层对TC4和IN718合金进行连续激光焊接,并分析添加中间层对接头裂纹、组织及力学性能的影响机制.结果表明,常规激光焊接时,TC4/IN718接头焊缝区产生大量Ti-Ni脆性金属间化合物,导致接头形成大量纵向裂纹,焊缝组织为Ti(s,s)+Ti2Ni+Ti-Cr+NiTi+Ni3Ti+Cr(s,s).当采用Cu/V复合中间层后,实现了TC4与IN718合金的有效连接,接头抗拉强度达到 271MPa,焊缝组织转变为Ti(s,s)+V(s,s)+NiV3+Cr(s,s)+Cu(s,s)+未熔铜.
Effect of Cu/V multi-interlayer on the microstructure and mechanical properties of TC4/IN718 joint by laser welding
In order to realize the effective connection between TC4 and GH4169 alloy,the Cu/V multi-interlayer was applied to join TC4 and IN718 alloy by continuous laser welding.The regulating mechanism of the Cu/V multi-interlayer on the cracks,microstructure and mechanical properties of TC4/IN718 joint was analyzed.The results show that a large number of Ti-Ni brittle intermetallic compounds are generated in the weld area of TC4/IN718 joint with the conventional laser welding,resulting in the formation of a large number of longitudinal cracks in the joint.The microstructure structure of weld zone in the TC4/IN718 joint is comprised of Ti(s,s)+Ti2Ni+Ti-Cr+NiTi+Ni3Ti+Cr(s,s).When adopting the Cu/V multi-interlayer,the effective joining between TC4 and IN718 alloy is realized,the tensile strength of the joint reaches 271MP.The microstructure structure of weld zone in the TC4/Cu/V/IN718 joint is transformed into Ti(s,s)+V(s,s)+NiV3+Cr(s,s)+Cu(s,s)+unmelted copper.

TC4/IN718 dissimilar metalslaser weldingmulti-interlayermicrostructuremechanical properties

朱强、夏阳、张星越、韩柯、闫耀晶、丁元毅、雷玉成

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江苏大学,材料科学与工程学院,镇江,212013

TC4/IN718异种金属 激光焊 复合中间层 微观组织 力学性能

国家自然科学基金资助项目特种焊接技术安徽省重点实验室资助项目

522053682023SW1003

2024

焊接学报
中国机械工程学会 中国机械工程学会焊接学会 机械科学研究院哈尔滨焊接研究所

焊接学报

CSTPCD北大核心
影响因子:0.815
ISSN:0253-360X
年,卷(期):2024.45(7)
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