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高密度BGA器件焊点脱焊分析及预防研究

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针对航空电子产品印制板组件焊点脱焊问题,以高密度BGA器件为研究对象,分析了导致焊点脱焊的主要原因,在于产品结构设计和工艺设计不当导致的应变应力及产品服役过程中的机械振动、热循环应力,其次是焊接过程中的不良特性.本文针对性提出了相关预防措施,并指明了下一步技术研究的工作方向.
Analysis and Prevention of Solder Joint Dewelding in High Density BGA Devices
In order to solve the problem of solder joint dewelding in printed circuit board components of aviation electronics products,the causes of solder joint dewelding are analyzed with high density BGA devices as the research object.The main cause of solder joint dewelding is the strain stress caused by improper product structure design and process design,mechanical vibration and thermal cycle stress during product service,and the second is poor welding process.The relevant preventive measures are put forward,and the direction of further technical research is pointed out.

BGAdeweldingvirtual weldingreliability

王大伟、王晨、徐子强、李德雄、费盟

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中国航空无线电电子研究所,上海 200241

BGA器件 脱焊 虚焊 可靠性

2024

航空电子技术
中国航空无线电电子研究所

航空电子技术

影响因子:0.349
ISSN:1006-141X
年,卷(期):2024.55(3)