In order to solve the problem of solder joint dewelding in printed circuit board components of aviation electronics products,the causes of solder joint dewelding are analyzed with high density BGA devices as the research object.The main cause of solder joint dewelding is the strain stress caused by improper product structure design and process design,mechanical vibration and thermal cycle stress during product service,and the second is poor welding process.The relevant preventive measures are put forward,and the direction of further technical research is pointed out.
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