摘要
传统的陶瓷烧结一般需要1000℃以上的高温,烧结周期长、能耗高.高温会对界面控制、物相稳定、材料共烧等产生不利影响,因此,很难以聚合物为填料实现陶瓷-聚合物复合材料的共烧.冷烧结技术通过引入中间液相溶解-沉淀过程,实现了在≤300 ℃时陶瓷的快速致密化,有效解决了陶瓷与聚合物的共烧问题.从冷烧结技术的发展概况出发,介绍了冷烧结工艺及致密化机制,详细阐述了冷烧结技术在陶瓷-聚合物复合材料中的应用及发展情况,包括微波介质材料、铁电材料、锂离子电池、压敏材料、半导体材料和热电材料,并分析了冷烧结技术目前待解决的问题,对冷烧结技术的未来发展做出展望.
Abstract
Typically,ceramics are sintered at temperatures of above 1000 ℃ by traditional sintering route,resulting in long sintering time and high energy consumptions.The high sintering temperatures adversely affect the interface control,phase stability,and material co-sintering,and thus,it is challenging to co-sinter ceramics and polymers with polymers as the fillers.Cold sintering process,employing an intermediate liquid phase and dissolution-precipitation process,enables rapid densification of ceramics at temperatures ≤ 300℃,which effectively addresses the co-sintering issue of ceramics and polymers.This review introduces the development of cold sintering process,sintering parameters and cold sintering mechanisms.The application and current status of cold sintering process in ceramic-polymer composites,such as microwave dielectrics,ferroelectrics,lithium-ion batteries,varistors,semiconductors and thermoelectric materials,are discussed in detail.Finally,the challenges and future prospects of cold sintering process are analyzed.
基金项目
国家自然科学基金(51902245)
陕西省自然科学基础研究计划(2024JC-YBMS-349)
广东省重点实验室开放课题(2021B1212040001)
维普
万方数据