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先进陶瓷黏结剂喷射增材制造技术发展与展望

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在过去的20年中,陶瓷黏结剂喷射增材制造技术已经成为制造复杂陶瓷构件的一种革命性方法,特别是在航空航天、生物医疗、电子信息等多个关键领域展现出显著的应用潜力与价值.本文全面回顾了此技术的基础原理、材料选择、工艺流程、性能特征及制造缺陷,并针对未来的挑战和目标进行了深入展望.文中首先详细概述了该技术的成型原理,对其与其他增材制造工艺的优势和局限进行了对比分析;然后综合总结了国际研究进展,重点包括陶瓷粉末的性能与处理、黏结剂的配置与其在粉床中的动力学行为、工艺参数的调整与后续致密化工艺,并讨论了这些因素如何影响初坯和最终制件的密度、孔隙结构、组织特性及性能;最后,基于现有研究成果和应用局限,本文对粉末原材料、黏结剂的设计、工艺参数优化等方面提出了前瞻性的发展建议.本篇综述旨在为理解和应用陶瓷黏结剂喷射增材制造提供全面的科学研究和工程实践指导.
Advanced Ceramic Binder Jetting Additive Manufacturing Technology:Development and Prospects
Over the last two decades,ceramic binder jetting additive manufacturing(BJAM)has emerged as a revolutionary technique for fabricating complex ceramic components,demonstrating significant potential and value in critical domains such as aerospace,biomedicine,and electronic information.This article comprehensively reviews the fundamental principles,material selection,process methodologies,performance characteristics,and manufacturing defects of this technology,along with an in-depth outlook on future challenges and objectives.Initially,the article elucidates the forming principles of this technology,juxtaposing its advantages and limitations against other additive manufacturing processes.It then synthesizes global research advancements,focusing on ceramic powder treatment and its properties,binder configuration and its dynamical behavior in powder beds,process parameter adjustments,and subsequent densification post-processing,discussing how these factors impact the density,porosity,microstructure,and performance of both green bodies and final components.Lastly,based on existing research outcomes and application limitations,the paper proposes forward-looking recommendations for the development of powder materials,binder design,and process parameter optimization.This review aims to provide comprehensive guidance for understanding and applying ceramic binder jetting additive manufacturing in scientific research and engineering practices.

Additive manufacturingBinder jettingCeramicsPowderBinderParameters

冯琨皓、赵威、毛贻桅、张正泰、叶春生、蔡道生、蒋文明、魏青松

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华中科技大学,武汉 430074

武汉易制科技有限公司,武汉 430000

增材制造 黏结剂喷射 陶瓷 粉末 黏结剂 工艺参数

中央高校基本科研业务费专项国家自然科学基金国家自然科学基金

YCJJ202303535227533352201040

2024

航空制造技术
北京航空制造工程研究所

航空制造技术

CSTPCD北大核心
影响因子:0.403
ISSN:1671-833X
年,卷(期):2024.67(4)
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