基于TSV技术的Ka频段硅基天线设计
Design of Two Ka-Band Silicon-Based Antennas Using TSV Technology
贺鹏超 1陈建忠 2王逸琳 2边明明 1张珂1
作者信息
- 1. 西安微电子技术研究所 西安 710049
- 2. 西安电子科技大学 西安 710071
- 折叠
摘要
TSV(Through-Silicon Via硅通孔)技术是现代集成电路设计的新型工艺.基于此工艺,针对射频通信系统小型化、高集成度的要求分别设计了工作于Ka频段的硅基多端口天线和单端口集成天线.整体结构采用CPW(Co-Planar Waveguide共面波导)和TSV结合的方式实现了对天线的馈电.在此基础上,分别设计了中心频率为35GHz的2×2四端口天线阵和中心频率为35.5GHz的单端口集成天线.仿真结果表明,天线阵列的相对带宽分别为2.88％和6.56％,增益约为4.57dBi 和 4.06dBi.
Abstract
Through-silicon via(TSV)is a new process for modern integrated circuit design.In this paper,two Ka-band silicon-based antennas including one 2x2 four-port antenna and one single-port integrated antenna are de-signed using the TSV technology to meet the requirements of RF communication systems in terms of miniaturization and high integration.The antennas combine coplanar waveguide(CPW)and TSV for feeding.The four-port anten-na has a center frequency of 35GHz.The single-port integrated antenna has a center frequency of 35.5GHz.The simulation results show that the relative bandwidths of the antennas are 2.88％and 6.56％,and their gains are ap-proximately 4.57dBi and 4.06dBi.
关键词
TSV工艺/硅基天线/Ka频段Key words
TSV process/silicon-based antenna/Ka band引用本文复制引用
出版年
2024
NETL
NSTL
万方数据