Through-silicon via(TSV)is a new process for modern integrated circuit design.In this paper,two Ka-band silicon-based antennas including one 2x2 four-port antenna and one single-port integrated antenna are de-signed using the TSV technology to meet the requirements of RF communication systems in terms of miniaturization and high integration.The antennas combine coplanar waveguide(CPW)and TSV for feeding.The four-port anten-na has a center frequency of 35GHz.The single-port integrated antenna has a center frequency of 35.5GHz.The simulation results show that the relative bandwidths of the antennas are 2.88％and 6.56％,and their gains are ap-proximately 4.57dBi and 4.06dBi.
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