首页|Laser-assisted grinding of RB-SiC composites:Laser ablation behavior and mechanism

Laser-assisted grinding of RB-SiC composites:Laser ablation behavior and mechanism

扫码查看
原文链接
  • NETL
  • NSTL
  • 万方数据
  • 维普
Laser ablation is an important process during Laser-Assisted Grinding(LAG)of hard and brittle materials.To realize controllable material removal during laser ablation of RB-SiC com-posites,ablation experiments under different Laser Energy Density(LAED)and LAG experiments are conducted.Evolution rules and mechanism of physical phase,ablation morphology and crack characteristics caused by laser irradiation are investigated.The forces of LAG and Conventional Grinding(CG)are compared.The results show that ablation surface changes from slight oxidation to obvious material removal with LAED increasing,and ablation depth increases gradually.The ablation products change from submicron SiO2 particles to nanoscale particles and floccule.High LAED promotes SiC decomposition and sublimation,which leads to the increase of C element.The SiC phase forms corrugated shape in recast layer and columnar shape in Heat Affected Zone(HAZ)at 56 J/mm2.The cold and heat cycle leads to formation of fishbone crack.For ablation specimen under 30 J/mm2,the grinding force can be reduced by a maximum of 39％and brittle damage region is reduced.The material removal and microcrack generated will significantly reduce the hardness and improve machinability,which can promote grinding efficiency.

RB-SiCLaserCeramicCompositesGrinding

Zhigang DONG、Wenchao SUN、Xintong CAI、Feng YANG、Yan BAO、Renke KANG、Dongjiang WU、Guangyi MA、Fangyong NIU

展开 >

Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education,School of Mechanical Engineering,Dalian University of Technology,Dalian 116024,China

Fundamental Research Funds for the Central Universities,ChinaFundamental Research Funds for the Central Universities,ChinaFundamental Research Funds for the Central Universities,ChinaHigh Level Talents Innovation Plan of Dalian,Chinafinancial support from the Shenzhen Science and Technology Innovation Commission Project,China

DUT21GF403DUT22YG210DUT22LAB1172020RD02JSGG20210420091802007

2024

10.1016/j.cja.2023.10.018

中国航空学报(英文版)
中国航空学会

中国航空学报(英文版)

CSTPCDEI
影响因子：0.847
ISSN：1000-9361
年,卷(期)：2024.37(1)
  • 5