首页|Hemispherical resonator with low subsurface damage machined by small ball-end fine diamond grinding wheel:A novel grinding technique

Hemispherical resonator with low subsurface damage machined by small ball-end fine diamond grinding wheel:A novel grinding technique

扫码查看
原文链接
  • 万方数据
  • 维普
As for the ultra-precision grinding of the hemispherical fused silica resonator,due to the hard and brittle nature of fused silica,subsurface damage(SSD)is easily generated,which enor-mously influences the performance of such components.Hence,ultra-precision grinding experi-ments are carried out to investigate the surface/subsurface quality of the hemispherical resonator machined by the small ball-end fine diamond grinding wheel.The influence of grinding parameters on the surface roughness(SR)and SSD depth of fused silica samples is then analyzed.The exper-imental results indicate that the SR and SSD depth decreased with the increase of grinding speed and the decrease of feed rate and grinding depth.In addition,based on the material strain rate and the maximum undeformed chip thickness,the effect of grinding parameters on the subsurface damage mechanism of fused silica samples is analyzed.Furthermore,a multi-step ultra-precision grinding technique of the hemispherical resonator is proposed based on the interaction influence between grinding depth and feed rate.Finally,the hemispherical resonator is processed by the pro-posed grinding technique,and the SR is improved from 454.328 nm to 110.449 nm while the SSD depth is reduced by 94％from 40 μm to 2.379 μm.The multi-step grinding technique proposed in this paper can guide the fabrication of the hemispherical resonator.

Fused silicaUltra-precision grindingHemispherical resonatorSubsurface damageGrinding technique

Biao QIN、Henan LIU、Jian CHENG、Jinchuan TIAN、Jiangang SUN、Zihan ZHOU、Chuanzhen MA、Mingjun CHEN

展开 >

State Key Laboratory of Robotics and System,Harbin Institute of Technology,Harbin 150001,China

Center for Precision Engineering,Harbin Institute of Technology,Harbin 150001,China

National Key Research and Development Program of ChinaNational Natural Science Foundation of ChinaSelf-Planned Task of State Key Laboratory of Robotics and System(HIT)

2022YFB340360052293403SKLRS202204C

2024

10.1016/j.cja.2023.08.022

中国航空学报(英文版)
中国航空学会

中国航空学报(英文版)

CSTPCDEI
影响因子：0.847
ISSN：1000-9361
年,卷(期)：2024.37(5)