首页|Microstructure evolution of ATI718 plus alloy during high-speed machining:Experiments and a combined FE-CA approach

Microstructure evolution of ATI718 plus alloy during high-speed machining:Experiments and a combined FE-CA approach

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Excellent surface integrity is an eternal pursuit in high performance manufacturing,with microstructure being a crucial component of the surface integrity dataset and a key factor control-ling surface properties such as fatigue and creep.The multi-physical fields generated by thermo-mechanical loads during high-speed machining act on the processed surface layer,influencing the evolution of microstructures.To investigate the microstructural evolution mechanisms of ATI718 plus during high-speed machining,cutting experiments and techniques such as Electron back scatter diffraction(EBSD),Transmission Kikuchi diffraction(TKD),and Precession electron diffraction(PED)is conducted to quantitatively analyze the microstructures in the chip shear zone and the machined surface.Subsequently,a combined finite element(FE)and cellular automata(CA)model is developed to simulate the microstructure evolution during the cutting process.The discontinuous dynamic recrystallization(DDRX)mechanism is employed to demonstrate the nucleation and growth of grains under the influence of multiple physical fields.The simulation and experimental results show similar dynamic recrystallization(DRX)grain sizes,indicating acceptable accuracy of the CA model in terms of DRX grain size.The comparison between experimental and simulation results confirms the occurrence of both continuous dynamic recrystallization(CDRX)and DDRX during the cutting process.The synergistic competition between CDRX induced grain lamellar refinement and DDRX induced grain growth emerge as the primary mechanism driving microstruc-tural evolution.A layer of ultrafine grains,with a thickness within 20 pm,is formed on the machined surface.Results under different parameters demonstrate that the temperature has a more significant impact on the thickness of the ultrafine grain layer and the diameter of grains within the layer compared to the strain rate.

Surface integrityDynamic recrystallizationMicrostructure evolutionFinite elementCellular automataHigh-speed machining

Xuhang GAO、Changfeng YAO、Liang TAN、Minchao CUI、Wenhao TANG、Guangyuan SHI、Jikang ZHAO、Jianxin LUO、Ya ZHANG

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The Key Laboratory of High Performance Manufacturing for Aero Engine,Ministry of Industry and Information Technology,Northwestern Polytechnical University,Xi'an 710072,China

Engineering Research Center of Advanced Manufacturing Technology for Aero Engine,Ministry of Education,Northwestern Polytechnical University,Xi'an 710072,China

2024

中国航空学报(英文版)
中国航空学会

中国航空学报(英文版)

CSTPCDEI
影响因子:0.847
ISSN:1000-9361
年,卷(期):2024.37(12)