Research on Integration Technology of W-band Antenna in Package Array
Taking W-band packaged antenna(AIP)as the research object,Aiming at the problems of poor accuracy,consistency and low yield in integrated manufacturing,make research from the suction nozzle material,structural design,pad pretreatment and process curve optimization,evaluating the fabrication effect of packaged antenna based on metallographic tangent results.The antenna in package by using the cross structure suction nozzle based on alumina material、cleaning the surface of the pad by plasma and vapor phase.The welding void rate of the package antenna is ≤5％,and the alignment accuracy is better than 20 μm.The shear strength ≥ 60 MPa.The integrated manufacturing of package antenna with high precision and high reliability is realized.
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