科学技术创新2024,Issue(11) :33-36.

W频段封装天线阵列集成技术研究

Research on Integration Technology of W-band Antenna in Package Array

张鹏哲 魏绍仁 冯青华 兰元飞 孙浩洋 郭中原
科学技术创新2024,Issue(11) :33-36.

W频段封装天线阵列集成技术研究

Research on Integration Technology of W-band Antenna in Package Array

张鹏哲 1魏绍仁 1冯青华 1兰元飞 1孙浩洋 1郭中原1
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作者信息

  • 1. 北京遥感设备研究所,北京
  • 折叠

摘要

以W频段封装天线(AIP)为研究对象,针对集成制造中的倒装精度差、一致性与成品率低等问题,从吸嘴材质、结构设计、焊盘预处理以及工艺曲线优化等方面开展研究,结合金相切剖结果评判封装天线集成制造效果.结果表明通过选用基于氧化铝材质的十字结构吸嘴、对焊盘表面进行等离子与汽相清洗、合适工艺参数曲线完成集成制造的封装天线的焊接空洞率≤5%,层间对准精度优于20 μm,剪切强度≥60 MPa,实现了封装天线高精度、高可靠的集成制造.

Abstract

Taking W-band packaged antenna(AIP)as the research object,Aiming at the problems of poor accuracy,consistency and low yield in integrated manufacturing,make research from the suction nozzle material,structural design,pad pretreatment and process curve optimization,evaluating the fabrication effect of packaged antenna based on metallographic tangent results.The antenna in package by using the cross structure suction nozzle based on alumina material、cleaning the surface of the pad by plasma and vapor phase.The welding void rate of the package antenna is ≤5%,and the alignment accuracy is better than 20 μm.The shear strength ≥ 60 MPa.The integrated manufacturing of package antenna with high precision and high reliability is realized.

关键词

W频段/封装天线/高精度倒装

Key words

W-band/Antenna in Package/high-precision inversion

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出版年

2024
科学技术创新
黑龙江省科普事业中心

科学技术创新

影响因子:0.842
ISSN:1673-1328
参考文献量1
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