Design and Development of Physical Layer for LTE Cat.1 IoT Chips
This article conducts research on the Cat.1 IoT chip development project of Xinmai Micro Semiconductor.Firstly,it briefly introduces the project development situation;Then,the focus was on elaborating the software and hardware collaborative development process of physical layer functions,software and hardware division,hardware resources and timing optimization of ASIC design,as well as power consumption related software and hardware design;Finally,plan a clear chip verification path to effectively expose the design issues of the ASIC module.
Cat.1LTE communication chipcommunication physical layerchip verification
NETL
NSTL
万方数据
