首页|基于COMSOL仿真的终端电磁热场缺陷温度场分析

基于COMSOL仿真的终端电磁热场缺陷温度场分析

Temperature Field Analysis of Terminal Electromagnetic Thermal Field Defects Based on COMSOL Simulation

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目的 针对现有单一物理场模型及两两耦合模型对缺陷高压电缆终端整体温度场分布研究不够准确的问题.方法 提出一种考虑负荷电流影响的电磁场、固体传热场及流体传热场多物理场有限元耦合模型,研究了 110kV电缆终端漏油与硅油劣化缺陷时的温度场分布特性.结果 据仿真研究显示随负荷电流增大,终端内部明显温升,从线芯到伞裙的温度逐渐降低.漏油缺陷会使得终端外表面温度产生空气域温度低于硅油域温度的分层现象,硅油劣化会产生终端局部发热而致使外表面应力锥附近最高温度升高.结论 在实际应用中,模型结果与实际值误差约在1%之内,研究明确了利用整体温度分布特征监测终端常见缺陷在实际应用的可行性.
Objective In response to the problem that the existing single physical field model and two-two coupling model are not accurate enough to study the overall temperature field distribution of defective high-voltage cable terminals,the multi-physical field finite element coupling model of electromagnetic field,solid heat transfer field and fluid heat transfer field considering the influence of load current was proposed.Methods The temperature field distribution characteristics of 110kV cable terminals with oil leakage and silicone oil degradation defects were studied by the model.Results In the simulation,the temperature inside the terminal rose significantly,with the in-crease of load current,and the temperature from the core to the umbrella skirt decreased gradually.The oil leak-age defect caused the temperature stratifying of the outer surface of the terminal with the temperature of the air domain lower than that of the silicone oil domain,and the degradation of the silicone oil made the terminal to heat up locally,resulting in an increase of the maximum temperature near the stress cone on the outer surface.Conclu-sion In practical application,the error between the model's results and the actual values is within 1%,and the study clarifies the feasibility of using the overall temperature distribution characteristics to monitor the common defects of terminals in practical application.

high voltage cable terminalsoil leakagesilicone oil degradationtemperature field simulation

郭家虎、苏宁

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安徽理工大学电气与信息工程学院,安徽 淮南 232001

高压电缆终端 漏油 硅油劣化 温度场仿真

2024

安徽理工大学学报(自然科学版)
安徽理工大学

安徽理工大学学报(自然科学版)

影响因子:0.331
ISSN:1672-1098
年,卷(期):2024.44(5)