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印刷电路板埋嵌铜专利技术分析

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[目的]印刷电路板埋嵌铜技术是印刷电路板实现散热功能的关键技术之一,探讨该领域的发展现状和研究热点,可为该领域发展提供参考.[方法]基于该领域全球和中国专利申请现状,针对该技术专利申请趋势、国家/地区分布、主要申请人、中国省市分布和重点专利技术进行了分析.[结果]①全球印刷电路板埋嵌铜领域专利申请数量将迎来新高,中国为该领域最大的专利申请国和公开国;②该领域重要申请人中,中国企业数量优势明显;③在中国各省市中,该领域专利技术高度集中在广东和江苏;④该领域重点专利技术发展分水岭为2010年,在此之前,重点专利多集中在美德日企业且数量较少,在此之后,该领域涌现出大量中国企业如景旺、崇达、英创力、五株等,且重点专利数量成倍增加.[结论]印制电路板埋嵌铜领域技术研究日趋集于中国企业,应注重高质量专利布局.
Analysis of Patent Technology for Embedded Copper in Printed Circuit Board
[Purposes]Embedded copper technology is one of the key technologies for printed circuit boards to realize the heat dissipation function.This paper discusses the development status and research hotspots in this field,and provides reference for the development of this field.[Methods]Based on the current status of global and Chinese patent applications in this field,from the perspective of patents this article analyzes the trend of patent applications for this technology,the distribution of countries/regions,the main applicants,the distribution of provinces and cities in China,and key patented technologies.[Findings]①The number of patent applications technology in the global printed circuit board embedded copper field will usher in a new high,and China is the largest patent applicant and publication country in this field;②Among the important applicants in this field,Chinese enterprises have obvious advantages in the number;③In china's provinces and cities,patented technologies in this field are highly concen-trated in Guangdong/Jiangsu provinces;④The watershed in the development of key patented technolo-gies in this field was 2010.Before that,most of the key patents were concentrated in American,German and Japanese companies and the number was small.After that,a large number of Chinese companies have emerged in this field,such as Kinwong,Suntak,IQE,Wuzhu,etc.,and the number of key patents has doubled.[Conclusions]Technology research in the field of printed circuit board embedded copper is increasingly concentrated in Chinese companies,and they should pay attention to high-quality patent layout.

printed circuit boardburied copperembedded copperpatent analysis

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深圳崇达多层线路板有限公司,广东 深圳 518000

印刷电路板 埋铜 嵌铜 专利分析

2024

河南科技
河南省科学技术信息研究院

河南科技

影响因子:0.615
ISSN:1003-5168
年,卷(期):2024.51(3)
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