Analysis of Patent Technology for Embedded Copper in Printed Circuit Board
[Purposes]Embedded copper technology is one of the key technologies for printed circuit boards to realize the heat dissipation function.This paper discusses the development status and research hotspots in this field,and provides reference for the development of this field.[Methods]Based on the current status of global and Chinese patent applications in this field,from the perspective of patents this article analyzes the trend of patent applications for this technology,the distribution of countries/regions,the main applicants,the distribution of provinces and cities in China,and key patented technologies.[Findings]①The number of patent applications technology in the global printed circuit board embedded copper field will usher in a new high,and China is the largest patent applicant and publication country in this field;②Among the important applicants in this field,Chinese enterprises have obvious advantages in the number;③In china's provinces and cities,patented technologies in this field are highly concen-trated in Guangdong/Jiangsu provinces;④The watershed in the development of key patented technolo-gies in this field was 2010.Before that,most of the key patents were concentrated in American,German and Japanese companies and the number was small.After that,a large number of Chinese companies have emerged in this field,such as Kinwong,Suntak,IQE,Wuzhu,etc.,and the number of key patents has doubled.[Conclusions]Technology research in the field of printed circuit board embedded copper is increasingly concentrated in Chinese companies,and they should pay attention to high-quality patent layout.