Microstructure Evolution of Cu/SAC305/Cu Micro-Solder Joint Interface IMCs Under Solid State Thermal Migration
[Purposes]This paper studies the microstructural evolution and non-uniform growth law of in-termetallic compounds in Cu/SAC305/Cu micro-solder joints under solid-state thermal migration condi-tions.[Methods]In this paper,the reflow soldering mechanism is used to prepare micro solder joints,and the thermal migration test is carried out by using the solid-state thermal migration platform.[Find-ings]As the thermal migration time increases,Cu3 Sn new phase forms at the Cu/Cu6 Sn5 interface on the cold side,and the total thickness of the intermetallic compounds(IMCs)at the interface increases.The morphology changes from a uniformly distributed fan-shaped structure to a layered structure.The micro-solder joint interface exhibits a non-uniform growth phenomenon where the growth rate of the IMCs on the cold side is significantly faster than that on the hot side.[Conclusions]This experiment investigates the microstructural evolution of Cu/SAC305/Cu micro-solder joints during service,providing valuable in-sights for reliability assessment.
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