高频铜箔的专利技术分析
Patent Analysis of High-frequency Copper Foil
姚日英 1刘红艳 1陈刚1
作者信息
- 1. 国家知识产权局专利局专利审查协作江苏中心,江苏 苏州 215011
- 折叠
摘要
[目的]重点分析高频铜箔的技术,对其申请状况、技术发展脉络和研发路线进行剖析,以掌握高频铜箔专利技术的发展情况.[方法]通过专利分析,重点研究高频铜箔专利申请的变化趋势、申请人区域分布、申请人排名、专利申请的技术构成等.[结果]日本、中国、美国、韩国是高频覆铜板铜箔专利申请的主要来源国/地区.[结论]在高频铜箔领域,日本专利储备丰富,占据了绝对优势,我国目前和未来潜在的专利障碍较大.中国龙头企业则是后来者居上,近年来得益于5G技术的发展和庞大的中国市场,在国际竞争中表现活跃.
Abstract
[Purposes]This study focuses on analyzing technology of high-frequency copper foil,profiling its application status,technological development and development routes to master development of high-frequency copper foil patent.[Methods]Through patent analysis,high-frequency copper foil patent appli-cation change trends,applicant area distribution,applicant ranking,technical make-up of patent appli-cation,and like were intensively studied.[Findings]Japan,China,USA,the republic of Korea are pri-mary origin regions where high-frequency copper clad copper foil patent applications are filed.[Conclu-sions]In the field of high-frequency copper foils,Japanese patent reserves are abundant and have abso-lute advantages.China's potential patent hurdles are large today and in the future.The Chinese leading enterprises gain rapid development with 5G technology and a large Chinese market in recent years,and they have been active in international competition.
关键词
高频铜箔/PCB/专利申请/技术分析Key words
high-frequency copper foil/PCB/patent application/technical analysis引用本文复制引用
出版年
2024
NETL
NSTL
万方数据