[Purposes]This study focuses on analyzing technology of high-frequency copper foil,profiling its application status,technological development and development routes to master development of high-frequency copper foil patent.[Methods]Through patent analysis,high-frequency copper foil patent appli-cation change trends,applicant area distribution,applicant ranking,technical make-up of patent appli-cation,and like were intensively studied.[Findings]Japan,China,USA,the republic of Korea are pri-mary origin regions where high-frequency copper clad copper foil patent applications are filed.[Conclu-sions]In the field of high-frequency copper foils,Japanese patent reserves are abundant and have abso-lute advantages.China's potential patent hurdles are large today and in the future.The Chinese leading enterprises gain rapid development with 5G technology and a large Chinese market in recent years,and they have been active in international competition.
NETL
NSTL
万方数据
