Failure Mode Analysis of CBGA Based on Interfacial Voids
With the improvement of the localization rate of aerospace products,Ceramic Ball Grid Array(CBGA)are applied more and more frequently.There are multiple interfaces in the solder joints of CBGA devices,and their failure modes are more complex.This paper explores the failure mode of a CBGA device in the stress screening test process,and finds that the voidage is not the decisive factor affecting the welding reliability of CBGA devices.The distribution of voids at the welding interface may have a greater impact on the reliability,and the location of voids in the solder joint is more critical than the size.It provides a new direction for improving the welding reliability of CBGA devices.
CBGAinterfacial voidsfailure analysisvoid distribution
万方数据
维普
