The Current Development Status and Future Prospects of Electronic Assembly Technology for High-end Equipment
With the gradual iteration and upgrading of high-end equipment in China towards informatization,digitization,and intelligence,the core electronic information modules of high-end equipment have also shown new development trends such as high product integration,high assembly accuracy requirements,and complex manufacturing processes.As a key technology in electronic fabrication,this new trend has brought new challenges and developments to electronic assembly technology.This article introduces the problems and challenges currently faced by electronic assembly technology firstly,and then systematically elaborates on the development of electronic assembly technology in recent years from three dimensions:optimization of electronic component assembly technology,modular optimization of electrical assembly technology,and diversified evolution of electrical assembly technology,from point to surface and then to overall technological innovation.Finally,combined with the current situation,it provides positive thinking and prediction for the future development trend of this technology.
万方数据
维普
