Design and Verification on Additive Manufacturing Vapor Chamber for High-power Spaceborne Electronic Devices
The future spaceborne high-power electronic devices exhibit characteristics of high power,high thermal flux and high integration.This paper introduces a novel vapor chamber based on additive manu-facturing(AM)technology to solve the problems of poor anti-gravity capability and low ultimate heat flux density due to the inferior property of traditional groove wick or mesh wick.By leveraging the ad-vantages of AM in forming complex geometries,a vapor chamber configuration based on composite cap-illary wick is designed.The microstructure has been analyzed using SEM(Scanning Electron Microsco-py)and Micro-CT(Micro-Computed Tomography).The results indicate that a continuous,interconnec-ted porous structure is obtained.The thermal performance tests show that 3D printed capillary wick can significantly enhance the heat transfer capability and ultimate heat flux density of vapor chamber.The 2D vapor chamber can accommodate a heat flux density of 88W/cm2 with a thermal resistance of only 0.024℃/W.The 3D vapor chamber exhibits significant changes in thermal resistance under different orientations.Relevant data can provide guidance for the thermal design and experiment of spaceborne high-power electronic equipment.
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