摘要
对市面购买的废旧电路板进行压力氧化—氰化提金试验研究,考察了物料细度、物料质量分数、氧化温度、氧化时间等对压力氧化预处理效果的影响.试验结果表明:在物料细度-0.25 mm占80%、物料质量分数30%、氧气分压2.0 MPa、氧化温度200℃、氧化时间3.0 h、硫酸用量90 kg/t、氧化剂用量25 kg/t条件下进行压力氧化预处理试验,而后在适宜条件下进行氰化提金试验,平均金浸出率可达92.52%.
Abstract
Experimental research was conducted on pressure oxidation-cyanide leaching for gold recovery from purchased waste circuit boards,investigating the effects of material fineness,material mass fraction,oxidation tempera-ture,oxidation time,etc.,on the effectiveness of pressure oxidation pretreatment.The experimental results showed that conducting pressure oxidation pretreatment under conditions of material fineness of-0.25 mm accounting for 80%,material mass fraction of 30%,oxygen partial pressure of 2.0 MPa,oxidation temperature of 200 °C,oxidation time of 3.0 h,sulfuric acid dosage of 90 kg/t,and oxidant dosage of 25 kg/t,followed by cyanide leaching under appropriate conditions,resulted in an average gold leaching rate of 92.52%.
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