首页|基于4.3 THz量子级联激光器的微米级无损厚度测量

基于4.3 THz量子级联激光器的微米级无损厚度测量

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  • 国家科技期刊平台
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  • NSTL
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构建和描述了一种用于获取硅片厚度的零差检测系统.利用4.3-THz激光束的传输相变与机械旋转台控制的入射角之间的关系,可以使用标准残差法精确推导被测样品的厚度值.结果表明,样品的厚度拟合值与光学显微镜的精确测量结果仅相差2.5～3 μm,实现了微米级精度的太赫兹无损厚度测量.实验验证了太赫兹量子级联激光器在非接触无损测量中的有效性.
Non-destructive thickness measurement with micron level accuracy based on a 4.3-THz quantum-cascade laser
A homodyne detection system to acquire the thickness of silicon wafers is constructed and described.By harnessing the relationship between the transmission phase change of a 4.3-THz light beam and the incident an-gle controlled by a mechanical rotating stage,the thickness value of sample can be precisely deduced using the standard residual error method.The results indicate that the fitted thickness of the sample differs by only 2.5～3 μm from more accurate results measured by optical microscopes,achieving terahertz non-destructive thickness measurement with micron level accuracy.The experiment validates the effectiveness of terahertz quantum-cas-cade laser in non-contact and nondestructive measurement.

terahertzquantum-cascade laserhomodyne detectionnon-destructive testingnon-contact measurement

李弘义、谭智勇、万文坚、曹俊诚

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中国科学院上海微系统与信息技术研究所,集成电路材料全国重点实验室,上海 200050

中国科学院大学材料科学与光电工程中心,北京 100049

太赫兹 量子级联激光器 零差探测 无损检测 非接触测量

National Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaScience and Technology Commission of Shanghai Municipal

61927813620350146227525821ZR1474600

2024

10.11972/j.issn.1001-9014.2024.03.009

红外与毫米波学报
中国光学学会 中国科学院上海技术物理所

红外与毫米波学报

CSTPCD北大核心
影响因子：0.612
ISSN：1001-9014
年,卷(期)：2024.43(3)
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