Enhancing Performance of Polyimide through Doping with a Flexible Diamine Monomer:Molecular Dynamics Simulations
Polyimide(PI)is recognized as a class of high-performance polymer materials,renowned for its exceptional properties.A significant challenge faced by conventional polyimide lies in its suboptimal processing performance during melting.In the present investigation,a novel polyimide monomer,Am-Di,characterized by a flexible structure composed of benzene rings connected by nitrogen atoms,has been meticulously designed.Thorough examinations have been undertaken to assess the characteristics of various Am-Di doping levels in polyimide,focusing on the glass transition temperature,mean square displacement,mechanical properties,and relative permittivity.The findings reveal that incorporating the new diamine into the polyimide system accelerates the movement of polyimide molecular chains,thereby reducing the glass transition temperature.Notably,at an Am-Di doping level of 20％,PI-20％demonstrates the highest elastic modulus(4.505 GPa),surpassing pure PI by 1.2 times.Additionally,the relative dielectric constant of polyimides decreases proportionally with the increase in the doping ratio.These results underscore the positive impact of Am-Di doping on polyimide properties,particularly in enhancing mechanical performance and adjusting electrical properties.These insights offer valuable guidance for further advancements in the design and application of polyimide materials.
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