Study on the Effect of Monomers Composition on Properties of Polyamides Hot Melt Adhesive
The dimer acid, sebacic acid, ethylene diamine and polyether amines are employed to synthesize dimer acid-based polyamide (PA) resin which is used as hot melt adhesive. The relationship between the compositions of monomers mentioned above and properties of PA resin are studied, such as softening point, tensile strength, elongation, iow temperature resistance and melt viscosity. And the effect of monomer composition on the shear strength is also discussed. The din,er acid based polyamide hot melt adhesive have many excellent properties, such aa high tensile strength and elongation, good high and low temporature resistance, fast forming speed, safety and enviroronent friendly and recyclable. It suits for iow pressure injection molding technology and can be widely applied in automotive industry, electronic components packaging and other advanced fields.
NETL
NSTL
万方数据
维普
