Study on Curing Technology and Properties of Epoxy Modified Cyanate Resin
Fourier infrared spectroscopy(FTIR),dynamic thermal analysis(DMA),differential thermal analysis(DSC)and dielectric properties test are used to analyze and compare the epoxy modified cyanate resin under different curing conditions,and its basic mechanical properties are tested.The experiments show that the FTIR,DSC curves and mechanical properties of the cyanate adhesive modified by epoxy resin cured at 155 ℃ for 6 h are similar to those of the adhesive film cured at 180 ℃ for 3 h,however,the glass transition temperature of the film cured at 180 ℃ for 3 h is the high-est,and the dielectric constant and dielectric loss are the lowest.