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一种基于GaAs和FO-WLP工艺的异质异构集成PDK

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异质异构集成技术是实现电子系统向微型化、高性能、低功耗及低成本方向发展的最重要方法,也是决定微电子系统领域未来发展的一项核心技术.为进一步推进异质异构集成技术研究,通过研究异质异构集成PDK的开发难点和开发方法,提出一种基于GaAs和FO-WLP工艺的异质异构集成PDK.该PDK对异质异构集成技术文件、器件模型、Pcell和物理验证文件进行创新并提供了支持,实现了在ADS平台上设计GaAs芯片封装电路,并通过ADS平台物理验证工具验证版图和原理图的准确性.
A Heterogeneous Integrated PDK Based on GaAs and FO-WLP Processes
Three-dimensional heterogeneous integration technology is the most important methodvery importantto realize the development of electronic systems towards miniaturization,high performance,low power consumption and low cost,and it is also a core technology that determines the future development of microelectronic systems.To further promote the research of heterogeneous integration technology,aheterogeneous integration PDK based on GaAs and FO-WLPprocess is proposed by studying the development difficulties and methods of heterogeneous integration PDK.The PDK innovates and supports the 3D heterogeneous integrated process model and its related ADS device units and ADS physical verification files,realizes the design of GaAs heterogeneous packaging circuits on the ADS platform,and verifies the accuracy of the layout and schematic diagram through the ADS platform physical verification tools.

Heterogeneous integrationPDKFO-WLPGaAs

董泽瑞、陈展飞、刘军

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杭州电子科技大学浙江省大规模集成电路设计重点实验室,浙江杭州 310018

异质异构集成 PDK FO-WLP GaAs

2024

杭州电子科技大学学报
杭州电子科技大学

杭州电子科技大学学报

影响因子:0.277
ISSN:1001-9146
年,卷(期):2024.44(1)
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