火炸药学报2024,Vol.47Issue(2) :152-158.DOI:10.14077/j.issn.1007-7812.202309016

EHTPB基黏结剂体系的低温固化

Curing of EHTPB-Based Adhesive Systems at Low Temperature

王晨 刘玉存 余思禹 刘洋君
火炸药学报2024,Vol.47Issue(2) :152-158.DOI:10.14077/j.issn.1007-7812.202309016

EHTPB基黏结剂体系的低温固化

Curing of EHTPB-Based Adhesive Systems at Low Temperature

王晨 1刘玉存 1余思禹 2刘洋君1
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作者信息

  • 1. 中北大学 环境与安全工程学院,山西 太原 030051
  • 2. 山西北方兴安化学工业有限公司,山西 太原 030051
  • 折叠

摘要

为了开发适用于PBX浇注炸药低温固化的黏结剂体系,选取环氧端羟基聚丁二烯(EHTPB)为黏结剂,用黏度增长法研究了添加二聚酸二异氰酸酯(DDI)、甲苯二异氰酸酯(TDI)、六亚甲基二异氰酸酯三聚体(HDI trimer)、异佛尔酮二异氰酸酯(IPDI)、二苯基甲烷二异氰酸酯(MDI)5 种固化剂在 45℃条件下黏度随时间的变化规律;并在35℃下研究体系中添加不同催化剂羰基铜化合物(YKT)、二月桂酸二丁基锡(T12)、三亚乙基二胺(DABCO)、辛酸亚锡(T9)、三苯基铋(TPB)对 EHTPB-DD I 黏结剂体系的催化反应效果;采用恒温流变技术对 EHTPB-DD I-YKT黏结剂体系的固化反应动力学进行了计算.结果表明,在 45℃条件下DDI 与 IPDI 的固化反应活性相近,可作为较为理想的固化剂;在 35℃下催化剂对 EHTPB-DD I 固化反应速率的影响顺序为:T12>T9>DABCO>YKT>TPB,其中添加 YKT时适用期为 5.45 h,符合固化工艺要求;通过反应速率判断出 EHTPB-DD I-YKT 黏结剂体系固化反应为自催化反应,计算出该黏结剂体系的表观活化能为 91.65 kJ/mol,反应级数为 0.836.EHTPB-DDI-YKT黏结剂体系能够有效降低黏结剂体系的固化温度,实现 EHTPB基PBX浇注炸药低温固化.

Abstract

In order to develop a binder system suitable for low temperature curing of PBX pouring explosives,epoxy hydroxy-terminated polybutadiene(EHTPB)was selected as binder.The viscosity changes with time at 45℃ of 5 kinds of curing agents including dimeric acid diisocyanate(DDI),toluene diisocyanate(TDI),hmethylene diisocyanate trimer(HDI trimer),isophor-one diisocyanate(IPDI)and diphenylmethane diisocyanate(MDI)were studied by viscosity growth method.The catalytic re-action effects of copper carbonyl compound(YKT),dibutyltin dilaurate(T12),triethylenediamine(DABCO),stannous capry-late(T9)and triphenylbismuth(TPB)on the EHTPB-DDI binder system were studied at 35℃.The curing reaction kinetics of EHTPB-DDI-YKT binder system was calculated by constant temperature rheological technique.The results show that DDI and IPDI have similar curing activity at 45℃,and both of them can be used as an ideal curing agent.At 35℃,the catalyst influ-ences the curing reaction rate of EHTPB-DDI in the following order:T12>T9>DABCO>YKT>TPB.Besides,the application period of YKT is 5.45 h with YKT added,which meets the curing process requirements.According to the reaction rate,the cu-ring reaction of EHTPB-DDI-YKT binder system is an autocatalytic reaction.It is calculated that the apparent activation energy of the binder system is 91.65kJ/mol and the reaction order is 0.836.The EHTPB-DDI-YKT binder system can effectively re-duce the curing temperature of the binder system and realize the low temperature curing of the EHTPB-based PBX pouring explo-sive.

关键词

物理化学/环氧端羟基聚丁二烯/EHTPB/PBX/低温固化/黏结剂/固化剂/Kawakita方程

Key words

physical chemistry/epoxy hydroxy-terminated polybutadiene/EHTPB/PBX/low themperature curing/binder/cu-ring agent/Kawakita equation

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出版年

2024
火炸药学报
中国兵工学会 中国兵器工业第204研究所

火炸药学报

CSTPCDCSCD北大核心
影响因子:0.841
ISSN:1007-7812
参考文献量23
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