首页|基于铝基含能配合物及CL-20含能微芯片的制备及表征

基于铝基含能配合物及CL-20含能微芯片的制备及表征

Preparation and Characterization of Energetic Microchips Based on Aluminized Energetic Coordination Polymers and CL-20

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为提高含能微芯片的能量特性和燃烧特性,推进其在微推进器、微驱动器、微毁伤器等装置中的应用,通过在铜箔上原位生长含能配位聚合物(ECP)、电子束沉积n-Al及重结晶CL-20的方法制备了 ECP@Al@CL-20的含能阵列,采用SEM、XRD、TG/DSC及高速摄影等表征方法对其微观形貌、物相组成、热分解特性、燃烧性能及贮存寿命进行了测试与分析.在此基础上,将其与微机电系统(MEMS)集成制得了功能性的ECP@Al@CL-20含能微芯片,并对含能微芯片进行了电容点火测试.结果表明,由于ECP的导热系数低,使ECP@Al@CL-20含能阵列从外到内的传热效率降低,导致放热峰温相比纯CL-20提高了 8.5℃,从而提高了 ECP@Al@CL-20的热稳定性;ECP@Al@CL-20含能阵列具有优异的燃烧性能,自持燃烧时间(340ms)远大于ECP@Al的自持燃烧时间(120ms),含能微芯片可在15mJ的输入能量下激发.
To enhance the energy characteristics and combustion performance of energetic microchips for their application in micro-propulsors,micro-actuators,and micro-detonators,the ECP@Al@CL-20 energetic array were synthesized through in si-tu growth of energetic coordination polymer(ECP)on copper foil,e-beam deposition of n-Al,and recrystallization of CL-20.The morphology,phase composition,thermal decomposition,combustion performance,and storage life were characterized by SEM,XRD,TG-DSC and high-speed photography.In addition,the functional ECP@Al@CL-20 energetic microchips were in-tegrated with microelectro mechanical system(MEMS)and subjected to capacitor ignition tests.The results show that the ECP@Al@CL-20 energetic array reduces heat transfer efficiency from outside to inside due to the low thermal conductivity of ECP,resulting an increase of 8.5 ℃ in the exothermic peak temperature compared to pure CL-20,thereby increasing the thermal sta-bility of ECP@Al@CL-20.The ECP@Al@CL-20 energetic array has excellent combustion performance,its self-sustaining combustion time(340ms)is much higher than that of ECP@Al(120ms),and it can be ignited under 15mJ of input energy.

energetic coordination polymersmicroelectro mechanical systemnano-AlCL-20micro heaterenergetic mi-crochipsECPMEMS

孟珂娟、马小霞、李宇翔、张开黎

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香港城市大学 工学院机械工程系,香港 999077

北京理工大学 机电学院,北京 100081

含能配位聚合物 微机电系统 纳米铝 CL-20 微加热器 含能微芯片 ECP MEMS

应用物理化学重点实验室项目

6142602210203

2024

火炸药学报
中国兵工学会 中国兵器工业第204研究所

火炸药学报

CSTPCD北大核心
影响因子:0.841
ISSN:1007-7812
年,卷(期):2024.47(5)