集成电路应用2024,Vol.41Issue(1) :57-59.DOI:10.19339/j.issn.1674-2583.2024.01.021

金属栅极中的功函数材料有效调节能力分析

Analysis of the Effective Adjustment Ability of Work Function Materials in Metal Gates

方精训 李二鹏
集成电路应用2024,Vol.41Issue(1) :57-59.DOI:10.19339/j.issn.1674-2583.2024.01.021

金属栅极中的功函数材料有效调节能力分析

Analysis of the Effective Adjustment Ability of Work Function Materials in Metal Gates

方精训 1李二鹏1
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作者信息

  • 1. 上海华力集成电路制造有限公司,上海 201314
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摘要

阐述不同膜厚、氧化时间和顶层功函数材料制备方法下,氮化钛对器件有效功函数和漏电流的调控能力.氮化钛膜厚增加,器件有效功函数增加的速率逐渐变缓,由0.16eVnm-1(0~2.1nm)下降到0.11eVnm-1(2.1~3.2nm).氮化钛氧化1h会使器件有效功函数降低0.05eV,但栅漏电流随之增加,对器件的可靠性产生不利影响.此外,采用物理气相沉积法制备钛铝要比使用原子层沉积法更有利于降低器件的有效功函数,可能与后者碳含量较高,铝扩散能力降低有关.

Abstract

This paper describes the ability of titanium nitride to regulate the effective work function and leakage current of devices under different film thicknesses,oxidation times,and top layer work function material preparation methods.As the thickness of the titanium nitride film increases,the rate of increase in the effective work function of the device gradually slows down,decreasing from 0.16 eVnm-1(0~2.1nm)to 0.11eVnm-1(2.1~3.2nm).Oxidation of titanium nitride for 1 hour can reduce the effective work function of the device by 0.05eV,but the gate leakage current increases accordingly,which has a negative impact on the reliability of the device.In addition,using physical vapor deposition method to prepare titanium aluminum is more conducive to reducing the effective work function of the device than using atomic layer deposition method,which may be related to the higher carbon content and reduced aluminum diffusion ability of the latter.

关键词

集成电路/功函数金属/有效功函数/氮化钛/钛铝

Key words

integrated circuit/work function metal/effective work function/titanium nitride/titanium aluminum

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量4
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