集成电路应用2024,Vol.41Issue(2) :63-65.DOI:10.19339/j.issn.1674-2583.2024.02.021

基于DMAIC改进模型的电气柜散热能力优化分析

Analysis of Optimizing the Heat Dissipation Capacity of Electrical Cabinets Based on DMAIC Improved Model

范佳伟 吴萍森
集成电路应用2024,Vol.41Issue(2) :63-65.DOI:10.19339/j.issn.1674-2583.2024.02.021

基于DMAIC改进模型的电气柜散热能力优化分析

Analysis of Optimizing the Heat Dissipation Capacity of Electrical Cabinets Based on DMAIC Improved Model

范佳伟 1吴萍森1
扫码查看

作者信息

  • 1. 上海微电子装备(集团)股份有限公司,上海 201210
  • 折叠

摘要

阐述半导体设备电气柜的散热能力决定设备电气性能,提出基于DMAIC改进模型的散热方案优化过程.仿真和实测结果表明,通过规范设计流程,量化试验指标,优化后的电气柜散热能力提升显著,从而提升机台的产能.

Abstract

This paper describes that the heat dissipation capacity of semiconductor equipment electrical cabinets determines the electrical performance of the equipment,and proposes an optimization process for heat dissipation schemes based on the DMAIC improved model.The simulation and actual measurement results show that by standardizing the design process,quantifying experimental indicators,and optimizing the heat dissipation capacity of the electrical cabinet,the production capacity of the machine is significantly improved.

关键词

集成电路制造设备/电气柜/散热能力/DMAIC改进模型

Key words

Integrated circuit manufacturing equipment/electrical cabinets/heat dissipation capacity/DMAIC improvement model

引用本文复制引用

出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量4
段落导航相关论文