摘要
阐述低电压供电、PCB设计的高密度与高速化、去耦电容优化和电热协同分析的问题、原因及挑战.以FPGA技术为重点,探讨其原理、特征以及在高频高速集成电路设计中的关键作用.
Abstract
This paper describes the problems,causes,and challenges of low voltage power supply,high-density and high-speed PCB design,optimization of decoupling capacitors,and analysis of thermoelectric synergy.Focusing on FPGA technology,it explores its principles,characteristics,and key roles in high-frequency and high-speed integrated circuit design.
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