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高频高速集成电路芯片设计中的FPGA解决方案分析

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阐述低电压供电、PCB设计的高密度与高速化、去耦电容优化和电热协同分析的问题、原因及挑战.以FPGA技术为重点,探讨其原理、特征以及在高频高速集成电路设计中的关键作用.
Analysis of FPGA Solutions in High Frequency and High Speed Integrated Circuit Chip Design
This paper describes the problems,causes,and challenges of low voltage power supply,high-density and high-speed PCB design,optimization of decoupling capacitors,and analysis of thermoelectric synergy.Focusing on FPGA technology,it explores its principles,characteristics,and key roles in high-frequency and high-speed integrated circuit design.

integrated circuitschip designFPGA

简震谦

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苏州异格技术有限公司上海分公司,上海 201210

集成电路 芯片设计 FPGA

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(2)
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