集成电路应用2024,Vol.41Issue(3) :54-55.DOI:10.19339/j.issn.1674-2583.2024.03.021

闪存隧穿氧化层侧向刻蚀界面的工艺优化

Analysis of Lateral Etching Interface and Process Improvement for Tunneling Oxide of Flash

郭国超
集成电路应用2024,Vol.41Issue(3) :54-55.DOI:10.19339/j.issn.1674-2583.2024.03.021

闪存隧穿氧化层侧向刻蚀界面的工艺优化

Analysis of Lateral Etching Interface and Process Improvement for Tunneling Oxide of Flash

郭国超1
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作者信息

  • 1. 上海华虹宏力半导体制造有限公司,上海 201203
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摘要

阐述在SONOS闪存存储生产工艺中,隧穿氧化层侧向刻蚀量是SONOS影响器件性能稳定性的关键因素之一.首次提出化学刻蚀液在氧化层和光阻界面的扩散距离是侧向刻蚀量的关键因素.

Abstract

This paper describes that in the production process of SONOS flash memory,the lateral etching amount of the tunneling oxide layer is one of the key factors affecting the performance stability of SONOS devices.It is the first to propose that the diffusion distance of chemical etching solution at the oxide layer and photoresist interface is a key factor in the lateral etching amount.

关键词

集成电路制造/湿法蚀刻/界面/侧向刻蚀/表面张力

Key words

integrated circuit manufacturing/wet etching/interface/lateral etching/surface tension

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量3
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