集成电路应用2024,Vol.41Issue(3) :56-57.DOI:10.19339/j.issn.1674-2583.2024.03.022

Flip Chip技术在集成电路封装中的应用

Application of Flip Chip Technology in Integrated Circuit Packaging

黄家友
集成电路应用2024,Vol.41Issue(3) :56-57.DOI:10.19339/j.issn.1674-2583.2024.03.022

Flip Chip技术在集成电路封装中的应用

Application of Flip Chip Technology in Integrated Circuit Packaging

黄家友1
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作者信息

  • 1. 贵州振华风光半导体股份有限公司,贵州 550018
  • 折叠

摘要

阐述从集成电路封装发展现状、Flip Chip技术内涵、Flip Chip技术在集成电路封装中的应用剖析、市场发展展望等多个角度,探讨在集成电路封装中,应用Flip Chip技术的必要性和重要性.

Abstract

This paper describes the necessity and importance of applying FlipChip technology in integrated circuit packaging from multiple perspectives,including the current development status of integrated circuit packaging,the connotation of FlipChip technology,the application analysis of Flip Chip technology in integrated circuit packaging,and market development prospects.

关键词

集成电路/Flip/Chip技术/电子器件封装

Key words

integrated circuits/Flip Chip technology/electronic device packaging

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量6
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