首页|Flip Chip技术在集成电路封装中的应用

Flip Chip技术在集成电路封装中的应用

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阐述从集成电路封装发展现状、Flip Chip技术内涵、Flip Chip技术在集成电路封装中的应用剖析、市场发展展望等多个角度,探讨在集成电路封装中,应用Flip Chip技术的必要性和重要性.
Application of Flip Chip Technology in Integrated Circuit Packaging
This paper describes the necessity and importance of applying FlipChip technology in integrated circuit packaging from multiple perspectives,including the current development status of integrated circuit packaging,the connotation of FlipChip technology,the application analysis of Flip Chip technology in integrated circuit packaging,and market development prospects.

integrated circuitsFlip Chip technologyelectronic device packaging

黄家友

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贵州振华风光半导体股份有限公司,贵州 550018

集成电路 Flip Chip技术 电子器件封装

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(3)
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