集成电路应用2024,Vol.41Issue(3) :58-59.DOI:10.19339/j.issn.1674-2583.2024.03.023

集成电路老化与可靠性试验分析

Analysis of Integrated Circuit Burn-in and Reliability Testing

朱文鹏 张瑞
集成电路应用2024,Vol.41Issue(3) :58-59.DOI:10.19339/j.issn.1674-2583.2024.03.023

集成电路老化与可靠性试验分析

Analysis of Integrated Circuit Burn-in and Reliability Testing

朱文鹏 1张瑞1
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作者信息

  • 1. 西安西谷微电子有限责任公司,陕西 710077
  • 折叠

摘要

阐述集成电路老化的试验原理、主流设备和标准.介绍GJB548要求、影响和异议.老化试验是一种无损试验,是剔除产品电测试不能识别的功能失效、参数漂移和存在潜在缺陷器件最有效的方法.

Abstract

This paper describes the testing principles,mainstream equipment,and standards of integrated circuit aging.It introduces the requirements,impact,and objections of GJB548.Burn-in test is a non-destructive test that is the most effective method to eliminate functional failures,parameter drift,and potential defective devices that cannot be identified by product electrical testing.

关键词

集成电路/功能失效/参数漂移/缺陷器件

Key words

integrated circuits/functional failure/parameter drift/defective devices

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量5
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