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集成电路老化与可靠性试验分析

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阐述集成电路老化的试验原理、主流设备和标准.介绍GJB548要求、影响和异议.老化试验是一种无损试验,是剔除产品电测试不能识别的功能失效、参数漂移和存在潜在缺陷器件最有效的方法.
Analysis of Integrated Circuit Burn-in and Reliability Testing
This paper describes the testing principles,mainstream equipment,and standards of integrated circuit aging.It introduces the requirements,impact,and objections of GJB548.Burn-in test is a non-destructive test that is the most effective method to eliminate functional failures,parameter drift,and potential defective devices that cannot be identified by product electrical testing.

integrated circuitsfunctional failureparameter driftdefective devices

朱文鹏、张瑞

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西安西谷微电子有限责任公司,陕西 710077

集成电路 功能失效 参数漂移 缺陷器件

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(3)
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