首页|PE3061设备晶圆位置偏差的产品识别技术分析

PE3061设备晶圆位置偏差的产品识别技术分析

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阐述LPE3061外延设备作为MOS产品外延生产的主力机台,生产过程中存在硅片位置偏离基座坑位的搭边异常现象.通过分析产品参数均匀性、产品外观变异性,探究现有产品探测识别机制的边界条件与适用性.
Analysis of Product Identification Technology for PE3061 Device Wafer Position Deviation
This paper describes that the LPE3061 epitaxial device,as the main machine for MOS product epitaxial production,has an abnormal phenomenon of silicon wafer position deviating from the base pit position during the production process.By analyzing the uniformity of product parameters and the variability of product appearance,it explores the boundary conditions and applicability of existing product detection and recognition mechanisms.

integrated circuitsepitaxial productionreaction loopsedge recognition

葛华、李树平、王银海、马梦杰

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南京国盛电子有限公司,江苏 211100

集成电路 外延生产 反应圈 搭边识别

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(3)
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