集成电路应用2024,Vol.41Issue(3) :68-69.DOI:10.19339/j.issn.1674-2583.2024.03.028

光刻制程中的核心工艺技术综述

Overview of Core Process Technologies in Photolithography Process

曲征辉
集成电路应用2024,Vol.41Issue(3) :68-69.DOI:10.19339/j.issn.1674-2583.2024.03.028

光刻制程中的核心工艺技术综述

Overview of Core Process Technologies in Photolithography Process

曲征辉1
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作者信息

  • 1. 沈阳芯源微电子设备股份有限公司,辽宁 110001
  • 折叠

摘要

阐述光刻制程的核心工艺技术,分析各工艺步骤特点及异常情况,包括气相成底膜、涂布、前烘、曝光、曝光烘烤、显影、硬烘、检验工序,为未来进一步工艺研究与生产制造提供理论依据.

Abstract

This paper describes the core process technology of photolithography,analyzes the characteristics and abnormal situations of each process step,including gas-phase film formation,coating,pre drying,exposure baking,development,hard drying,and inspection processes.It provides a theoretical basis for further process research and production manufacturing in the future.

关键词

集成电路/光刻工艺/涂胶/显影/烘烤

Key words

integrated circuits/lithography process/gluing/development/baking

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
参考文献量3
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