Analysis of Wire Bonding Tail Wire Control Method in Electronic Device Packaging
This paper expounds the formation reasons,influencing factors,and corresponding control methods of wire bonding tail wires.By comprehensively analyzing traditional control methods and advanced control methods,including process optimization,equipment parameter adjustment,model predictive control,adaptive control,and intelligent optimization control,feasible solutions are proposed.It explores the situation,potential issues,and challenges of wire bonding tail wire control methods in industrial applications.