Analysis of the Key Influence Factor and Adjustment of Contact Etch Resistance in CT-ET Process
This paper describes that the size,profile and the bottom feature is the key influence factor of the contact hole's resistance.Different contact etch layer's etch gas and power is different.It studies the different etch step how to affect the CT hole size/profile/the bottom feature,to find the key influence factor to affect CTRC.So it defines the control table of this layer,to enlarge the process window.
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