基于P-BiCS架构的hynix 3D Nand Flash产品结构分析
Analysis of hynix 3D Nand Flash Product Structure Based on P-BiCS Architecture
田新儒1
作者信息
- 1. 上海贝岭股份有限公司,上海 200233
- 折叠
摘要
阐述随着电子产品及大数据信息存储应用需求增加,3D Nand Flash产品市场持续增长.介绍一种主流的3D Nand Flash技术架构,并分析应用P-BiCS架构的hynix 3D Nand Flash产品的结构及成分.
Abstract
This paper describes that with the increasing demand for electronic products and big data information storage applications,the 3D Nand Flash product market continues to grow.Introduce a mainstream 3D Nand Flash technology architecture and analyze the structure and components of hynix 3D Nand Flash products using P-BiCS architecture.
关键词
存储器芯片/3D/Nand/Flash/P-BiCS架构Key words
memory chips/3D Nand Flash/P-BiCS architecture引用本文复制引用
出版年
2024
NETL
NSTL
万方数据