首页|基于P-BiCS架构的hynix 3D Nand Flash产品结构分析

基于P-BiCS架构的hynix 3D Nand Flash产品结构分析

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阐述随着电子产品及大数据信息存储应用需求增加,3D Nand Flash产品市场持续增长.介绍一种主流的3D Nand Flash技术架构,并分析应用P-BiCS架构的hynix 3D Nand Flash产品的结构及成分.
Analysis of hynix 3D Nand Flash Product Structure Based on P-BiCS Architecture
This paper describes that with the increasing demand for electronic products and big data information storage applications,the 3D Nand Flash product market continues to grow.Introduce a mainstream 3D Nand Flash technology architecture and analyze the structure and components of hynix 3D Nand Flash products using P-BiCS architecture.

memory chips3D Nand FlashP-BiCS architecture

田新儒

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上海贝岭股份有限公司,上海 200233

存储器芯片 3D Nand Flash P-BiCS架构

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(6)