ATE芯片测试中的成测修调方法分析
Analysis of Testing and Triming Methods in ATE Chip Testing
朱刚俊 1董泽芳 1马培1
作者信息
- 1. 南京微盟电子有限公司,江苏 210023
- 折叠
摘要
阐述基于ATE测试中集成电路成测修调的方法.介绍目前芯片封装测试环节常见的成测修调种类,包括多晶硅结构的熔丝修调、齐纳二极管的齐纳修调、EPROM/EEPROM结构的数字修调.
Abstract
This paper describes the method of integrated circuit testing and triming based on ATE testing.It introduces the common types of testing and triming in the current chip packaging triming process,including fuse triming in polycrystalline silicon structures,Zener triming in Zener diodes,and digital triming in EPROM/EEPROM structures.
关键词
集成电路/芯片成测/修调/ATEKey words
integrated circuit/chip testing/triming/ATE引用本文复制引用
出版年
2024
NETL
NSTL
万方数据