Effect of Desmear on Peel Strength in Semi-additive Process
This paper expounds desmearisa critical step in the semi-additive process,and it is necessary to ensure that the adhesion between the dielectric material and the copper layer does not decrease after the desmear is completed.Through tensile testing,scanning electron microscopy,time-of-flight secondary ion mass spectrometry,and X-ray photoelectron spectroscopy,the influence mechanism of the desmear on the peel strength between the sample resin and copper layers was analyzed.The results show that the failure mode of the sample is the cohesion failure of the resin,and the holes on the surface of the resin are damaged after the desmear,resulting in the penetration of Mn and Cu plasma into the resin and the oxidation of the resin,thereby reducing the cohesion of the resin.Therefore,in actual production,it is necessary to adjust parameters such as the concentration of the reagents to prevent the occurrence of holes.
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