This paper expounds the technology of software radio and advanced chip integration technology,and conducts research on the System in Package(SiP)architecture of chip-level integration of sub-modules of different functional RF systems,so as to meet the requirements of future communication equipment for ultra-wideband(UWB),reconfigurable arrays,and miniaturization.
关键词
电磁通信装备/射频处理系统/超宽带/可重构阵列/系统级封装
Key words
electromagnetic communication equipment/RF processing system/UWB/reconfigurable array/SiP