This paper expounds the technology of software radio and advanced chip integration technology,and conducts research on the System in Package(SiP)architecture of chip-level integration of sub-modules of different functional RF systems,so as to meet the requirements of future communication equipment for ultra-wideband(UWB),reconfigurable arrays,and miniaturization.
electromagnetic communication equipmentRF processing systemUWBreconfigurable arraySiP
维普
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