集成电路应用2024,Vol.41Issue(8) :28-29.DOI:10.19339/j.issn.1674-2583.2024.08.011

多层瓷介电容器的声学扫描检查分析

Analysis of Acoustic Scanning Inspection of Multilayer Ceramic Capacitors

聂延伟
集成电路应用2024,Vol.41Issue(8) :28-29.DOI:10.19339/j.issn.1674-2583.2024.08.011

多层瓷介电容器的声学扫描检查分析

Analysis of Acoustic Scanning Inspection of Multilayer Ceramic Capacitors

聂延伟1
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作者信息

  • 1. 西安西谷微电子有限公司,陕西 710077
  • 折叠

摘要

阐述声学扫描检查(SAM)瓷介电容器内部缺陷的可行性,探讨多层瓷介电容器声学扫描检查研究目的及价值.介绍多层瓷介电容器内部空洞、分层及裂纹等缺陷的检测方法,并对结果进行验证.

Abstract

This paper describes the feasibility of acoustic scanning inspection(SAM)for detecting internal defects in ceramic capacitors,and explores the research purpose and value of acoustic scanning inspection for multi-layer ceramic capacitors.It introduces the detection methods for defects such as voids,delamination,and cracks inside multilayer ceramic capacitors,and verifies the results.

关键词

多层瓷介电容器/内部缺陷/声学扫描检查

Key words

multi-layer ceramic capacitors/internal defects/acoustic scanning inspection

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出版年

2024
集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
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