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多层瓷介电容器的声学扫描检查分析

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阐述声学扫描检查(SAM)瓷介电容器内部缺陷的可行性,探讨多层瓷介电容器声学扫描检查研究目的及价值.介绍多层瓷介电容器内部空洞、分层及裂纹等缺陷的检测方法,并对结果进行验证.
Analysis of Acoustic Scanning Inspection of Multilayer Ceramic Capacitors
This paper describes the feasibility of acoustic scanning inspection(SAM)for detecting internal defects in ceramic capacitors,and explores the research purpose and value of acoustic scanning inspection for multi-layer ceramic capacitors.It introduces the detection methods for defects such as voids,delamination,and cracks inside multilayer ceramic capacitors,and verifies the results.

multi-layer ceramic capacitorsinternal defectsacoustic scanning inspection

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西安西谷微电子有限公司,陕西 710077

多层瓷介电容器 内部缺陷 声学扫描检查

2024

集成电路应用
上海贝岭股份有限公司

集成电路应用

影响因子:0.132
ISSN:1674-2583
年,卷(期):2024.41(8)