Design and Heat Transfer Performance Study for Liquid Cooling Subrack
In order to meet the operating temperature requirements of subrack printed board with increasing power,the liquid cooling subrack cooling form of the liquid passing through subrack frame and the temperature equalization board plug-in module is adopted.According to the appear-ance of subrack and the heat consumption distribution requirements of the plug-in module,the sub-rack structure is designed.The heat transfer path of the subrack is analyzed,and the internal fluid flow is optimized based on the subrack structure.When the requirement of flow resistance is met,the spoiler micro-flow path is used to strengthen the heat transfer design locally.Finally,the heat transfer performance and flow resistance performance of the liquid cooling subrack are verified by heat flow simulation.The simulation results show that the cooling performance of the liquid cool-ing subrack is good,and the heat dissipation of a single printed board subrack module can be more than 140 W,and the maximum temperature of the plug-in cooling shell is 75 ℃.
liquid cooling subrackmicro-flow pathtemperature equalization boardheat flow simu-lationheat transfer performance
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