某高热密度风冷机箱热设计与仿真
Thermal Design and Simulation of a High Thermal Density Air-cooled Chassis
王帅 1余涛 1韩钟剑1
作者信息
- 1. 中国电子科技集团公司第二十研究所 西安 710068
- 折叠
摘要
论文设计了一种高热流密度强迫风冷机箱,为满足机箱总热耗800W的散热需求,通过风道设计、风阻计算、风机选型对机箱进行散热设计.同时,利用Ansys Icepak分析软件对机箱进行热仿真分析.结果显示,环境温度50℃下,机箱内部安装16个热耗50W模块时,发热芯片壳体温度最高为71.4℃;机箱内部安装10个热耗80W模块时,发热芯片壳体温度最高为85.6℃,满足散热设计需求.机箱进出口温差约9.6℃,风机工作点合理,理论计算与仿真结果接近.
Abstract
In this paper,a high heat flux forced air cooling case is designed.In order to meet the heat dissipation requirements of the chassis with a total heat consumption of 800W,the heat dissipation design of the chassis is carried out through air duct design,wind resistance calculation and fan selection.At the same time,the thermal simulation analysis of the chassis is carried out using An-sys Icepak analysis software.The results show that under the ambient temperature of 50℃.When 16 modules with a heat consump-tion of 50 W are installed inside the chassis,the highest temperature of the heating chip housing is 71.4℃;when 10 modules with a heat consumption of 80 W are installed inside the chassis,the highest temperature of the heating chip housing is 85.6℃,which meets the design requirements of heat dissipation.The temperature difference between the inlet and outlet of the chassis is about 9.6℃,the fan operating point is reasonable,and the theoretical calculation is close to the simulation results.
关键词
高热流密度/强迫风冷机箱/热设计/Ansys/IcepakKey words
high thermal flux/forced air cooling chassis/thermal design/Ansys Icepak引用本文复制引用
基金项目
基础加强计划技术领域基金项目(2021-JCJQ-JJ-1018)
出版年
2024
国家科技期刊平台
NSTL
万方数据