Thermal Analysis and Simulation of Locomotive Traction Control Unit Control Chip
This article conducts heat dissipation design and simulation research on the high-speed processor chip on the core control circuit board of the locomotive traction control unit,and improves the thermal design that does not meet the heat dissipation requirements.By comparing the simulation results of specific heat and the temperature rise of chips in practical application environments,it is fully verified that thermal simulation has guiding significance for heat dissipation design.
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