机车牵引控制单元控制芯片热分析及仿真
Thermal Analysis and Simulation of Locomotive Traction Control Unit Control Chip
丁馨楠 1王文奇 2朱振新 3李彬 3孙晨光3
作者信息
- 1. 中国中车大连电力牵引研发中心有限公司,辽宁大连 116000
- 2. 大连地铁运营有限公司,辽宁大连 116000
- 3. 中国铁路北京局集团公司,北京 100860
- 折叠
摘要
本文对机车牵引控制单元核心控制电路板卡上高速处理器芯片进行散热设计和仿真研究,并对不满足散热需求的热设计进行改进.通过对比热仿真结果和实际应用环境下的芯片温升,充分验证了热仿真对散热设计具有指导意义.
Abstract
This article conducts heat dissipation design and simulation research on the high-speed processor chip on the core control circuit board of the locomotive traction control unit,and improves the thermal design that does not meet the heat dissipation requirements.By comparing the simulation results of specific heat and the temperature rise of chips in practical application environments,it is fully verified that thermal simulation has guiding significance for heat dissipation design.
关键词
芯片/散热/仿真Key words
Chip/Heat dissipation/Simulation引用本文复制引用
出版年
2024
NETL
NSTL
万方数据